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HuaSin Union Technology(ShenZhen) Co.,Ltd,HuaSin Union,Medium and high-end PCB, copper substrate, ceramic board, soft and hard board, high frequency board, HDI
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SMT patch
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Item
Current
2013
2014
Max. Layer
48
36
40
Track width/space
inner（mil）
2 / 2
3 / 3
2.5/ 2.5
outer（mil）
2 / 2
4 / 3
3 / 3
Aspect Ratio
16 : 1
14 : 1
15 : 1
Copper Weight (oz)
12
8
10
Impedance tolerance
±5%
±8%
±5%
Material
Microwave material
SV
SV
SV
Via in pad
SV
SV
SV
Lead-free
MP
MP
MP
Mix lamination
SV
P
SV
Metal Based/Core
SV
P
SV
HiTg
MP
MP
MP
HDI
4+N+4
SV
/
P
Buried resistance/electric capacity
SV
/
P
P: Prototype SV: Small Volume    MP: Mass Production
 
 
 

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