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HuaSin Union Technology(ShenZhen) Co.,Ltd,HuaSin Union,Medium and high-end PCB, copper substrate, ceramic board, soft and hard board, high frequency board, HDI
Provide one-stop service for the whole process of R&D, design and manufacturing!
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Provide one-stop service for the whole process of R&D,
design and manufacturing!
Home > Products
SMT patch
Product Service
Applications
PCB specifications
Surface Treatment
Process capability
Major equipment
R&D direction
Engineering support
Item
Capability
Remark
Layer count
2~48 layer
Lamination
FR-4,Aluminum Based,Copper based,High frequency plate,Heavy copper,BT,Rogers,PTFE ect
Thickness(THK)
0.2mm≤THK≤6.0mm
Smallest hole(mm)
0.1mm
Aspect Ratio
16:1
Max dimension
Single or 2-layer
Multi-lyr
≤6layer
≥8layer
Gold THK
Hard Gold (u")
Immersion Gold (u")
Copper Weight
Outer (oz)
Inner (oz)
600 x 1200 mm
600 x 900 mm
500 x 600 mm
50u"
4u"
10 oz
6 oz
Smallest trace width / space (mil)
Annual ring
Via hole
Component hole
Copper to edge spacing
3/3 mil
3mil
6mil
0.25mm
Min trace width / space (mil)
Base Copper (oz)
Min trace width / space (mil)
0.5
3/3
1
4/4
2
5/5
3
7/7
5
9/9
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HuaSin Union Technology(ShenZhen) Co.,Ltd
Tel:0086-0755-33098987
Address:3rd Floor, Building 15, Xingwei Fenghuang Third Industrial Zone, Fuyong Street, Baoan District, Shenzhen
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ICP: 19058180
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